Northrop Grumman to Develop Hybrid Thermal Ground Plane

August 4, 2008
By Katie Packard

Northrop Grumman Corporation has been selected by the Defense Advanced Research Projects Agency (DARPA) to develop and demonstrate an ultra high-capacity hybrid thermal ground plane needed to overcome heat-related challenges in semiconductors employed in electronic systems. The $1.7 million, 18-month, cost-plus-fixed-fee contract is for the first phase of the three-phase DARPA program.

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