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Raytheon Awarded DARPA Contract to Develop HEALICS Technology

October 15, 2009
By Henry Kenyon

The Defense Advanced Research Projects Agency (DARPA) has awarded Raytheon Company a $5.5 million contract to design, fabricate and test Self-HEALing mixed signal Integrated Circuits (HEALICS) technology. The effort will incorporate self-healing into a complex system-on-chip design, providing the capability for the chip to sense undesired circuit behaviors and correct them automatically.