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NASAMS for Ukraine

Mississippi State University to Conduct IT Research

President's Helicopter Maintenance

Contract for C-130 Propellers

Army Anounces Contract Award for National Advanced Surface to Air Missile Systems

The Army’s Program Executive Office for Missiles and Space leads production of this weapon system.

National Advanced Surface to Air Missile System. Credit: U.S. Army.

Enabling Operations With Cross-Domain Transfer and Access

Sponsored Content

Multidomain collaboration is an important part of enabling operations.

Enabling Cybersecurity in Space With Digital Engineering

Five keys to ensure future success.

Ground stations play an important role in satellite infrastructures. Not only do they provide command and control to satellites themselves but also link satellite constellations to the terrestrial backbone of the internet. Credit: vchal/Shutterstock

Blockchain for Assured Combat ID at Internet-Scale

Blockchain technologies can help military decision-makers to shorten the kill chain.

A Thunderhead High-Altitude Balloon System, launched by U.S. Army Pacific Soldiers, takes flight during Balikatan 22 on Fort Magsaysay, Nueva Ecija, Philippines, in April. Balikatan is an annual exercise between the Armed Forces of the Philippines and U.S. military designed to strengthen bilateral interoperability, capabilities, trust, and cooperation built over decades of shared experiences. Credit: Spc. Darbi Colson/DVIDS

New Beam-Steering Antenna Opens Rarely Used Spectrum

Researchers seek industry investors.

Researchers at the University of Birmingham in the United Kingdom have developed a new beam steering antenna that has achieved unprecedented efficiency rates and opens for use new areas of spectrum. Credit: The Metamaterial Engineering Laboratory, University of Birmingham and agsandrew /Shutterstock

DARPA Eyes Complex 3D Microelectronics

The agency aims to spur 4th-generation-layered microelectronics manufacturing.

In February 2023, the Defense Advanced Research Projects Agency (DARPA), with the help of industry, will start planning its unique manufacturing facility to prototype groundbreaking three-dimensional heterogeneous integration, or 3DHI, chips, as part of its Electronics Resurgence Initiative that began in 2019. Image courtesy of DARPA