Northrop Grumman to Provide Integrated Circuit Design Support

Northrop Grumman Systems Corporation, Linthicum Heights, Maryland, has been awarded a $7,134,347 cost-plus-fixed-fee contract for a research project under the Common Heterogeneous Integration and Intellectual Properties Reuse Strategies (CHIPS) program solicited under broad agency announcement number DARPA-BAA-16-62. The CHIPS program seeks to develop the design tools and integration standards required to demonstrate modular integrated circuit designs that leverage the best of Department of Defense and commercial designs and technology. Work will be performed in Linthicum Heights with an expected completion date of September 2021. Fiscal year 2017 research, development, test and evaluation funding in the amount of $2,388,785 is being obligated at time of award. This contract was a competitive acquisition under an open broad agency announcement and 43 offers were received. The Defense Advanced Research Projects Agency, Arlington, Virginia, is the contracting activity (HR001117C0091).