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Sponsored: Innovative Solutions for SWaP-Constrained Defense Systems

Mercury Systems offers military-grade microelectronics packaging for the 21st century.

As the need for more sensor processing and embedded security continues to grow in defense applications such as unmanned systems and munitions, the footprint for these mission-critical systems continues to shrink. A fundamental shift in microelectronics design and packaging is required to address the needs of the modern threat environment where non-invasive attacks are imminent.

With a deep domain expertise in systems security engineering and three-dimensional microelectronics packaging, Mercury Systems addresses these challenges with a revolutionary new technology, BuiltSECURE ™ System-in-Package (SiP). Targeting high-performance, SWaP-constrained defense computing systems with a fully customizable architecture and embedded security, each BuiltSECURE SiP device is delivered as a highly ruggedized ball grid array (BGA) package at a fraction of the typical cost and schedule of long lead application specific integrated circuits. Mercury’s innovation is ideal for platform management systems, mission management systems and command, control and intelligence applications. Highlights of BuiltSECURE SiP include:

SWaP optimized: Mercury’s advanced miniaturization and stacking technology minimizes footprint allowing more functionality in constrained spaces.
Agile customization: An accelerated time to market is achieved with the rapid prototyping of the optimal processing solution including microprocessors, field-programmable gate array (FPGA) devices, memory modules, sensor components and security features for each unique program.
Advanced thermal management: Sophisticated design tools enable each device to dissipate more than 100W of power to meet the processing demands of modern processors and FPGA devices.
Embedded security: Integrated secure boot capability is complemented with optional personalized security solutions to detect and mitigate adversarial attacks.
Trusted design and manufacturing: All of Mercury’s digital microelectronics solutions, including BuiltSECURE SiP devices, are designed and manufactured in a DMEA-accredited facility protected by a vigilant cybersecurity program.